Ideal for Production Lift-Off, Step-Coverage, and Dual-Sided Coating Applications
The Temscal FC-3800 enables rapid processing of 150mm diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 150mm diameter wafers for lift off or thirty-six 150mm wafers for step coverage. The 38″ x 38″ x 28″ product chamber is pumped by a high throughput 16″ cryopump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10″ cryopump.
Convenient Maintenance
The offset pumping port, the hinged door panels, and the swingout source tray are high-value maintenance features in Temescal systems. The offset pumping design reduces unscheduled downtime by minimizing the possibility of debris entering the pumping module. The hinged door panels open to the pumping system and the vacuum chamber. The electric hoist and the swing-out source tray facilitate access for evaporant reloading, cleaning, and maintenance. Access to the water manifold, the bellows-sealed high-vacuum valve, and other pumping system components is also simple and direct.
Key features:
- Product chamber dimensions: 28″ high x 38″ x 38″
- 25.5″ diameter source tray
- Standard source-to-substrate distance: 34″
- S-S distance with optional source well extension collar: 38″
- Product and source chamber cryopumps
System Control
- Temescal Control System (TCS), providing auto, manual, and service modes plus process datalogging
- TCS-based process variable monitoring (PVM) allows user to set process tolerance alarms
- Inficon XTC/3 deposition controller electron beam source, power supply, and sweep
- Temescal removeable-cover turret source, 4- or 6-pocket
- Temescal model CV-12SLX electron beam power supply
- Temescal SuperSweep64 programmable beam sweep controller
Vacuum pumping and control
- Edwards model iGX100L dry roughing pump, with a pumping speed of 62 cfm (105 m3/h-1)
- Source chamber cryopump: CTI model CT-10 On-Board
- Product chamber cryopump: CTI model CT-400 On-Board
- Edwards active inverted magnetron gauges and Pirani controllers, monitored and controlled by the TCS
- Cryopump temperature monitoring
Water System
- Stainless steel manifold provides cooling water for source and product chamber components
- Separate product chamber circuit for cold and optional hot water
Air System
- PLC-controlled air manifold Load-Lock Systems Optimized for Lift- Off Applications (Gate, Ohmic, TFR)
Miscellaneous/System-Wide
- 5 EMO switches
- Standard 19-in.-wide electronics rack on casters
- Surfaces exposed to high vacuum are made of 304 SST
Source Chamber
- Drop-down, swing-out source tray, accessible from either front or left side of vacuum cubicle
- Wide-angle 4-in. viewport for source observation
- Removeable stainless-steel source tray debris shield
- Gate valve with moveable shield
- Source tray diameter: 25.5 in. (648 mm)
Product Chamber
- 28 in. high x 38 in.2 (711 mm x 965 mm2)
- Two sets of product chamber evaporation shields
- Two blanked-off RGA ports
- Left-side door for service access
- Wide-angle viewports on front and left side
- TP-8 90-angle-of-incidence substrate dome
- One fixed uniformity mask
Temescal Control System
The Temescal Control System (TCS) provides fully integrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging.
TCS System Map During Deposition
The TCS Automatic Mode
Auto mode operation provides fully automated execution of user-programmed recipes consisting of up to twenty process steps, as well as full abort diagnostics. The TCS auto mode also offers independent autopump and autovent operations, automated cryopump regeneration, and automated rate-of-rise testing.
Manual Mode Operation
The TCS manual mode enables the user to set process parameters, operate major components and subsystems individually with full interlock protection, and execute nonautomated single-film deposition processes.
Service Mode Operation
The TCS service mode provides noninterlocked low-level control over any of the system’s valves, pumps, motors, or power supplies.
Options
System control
- SECS/GEM interface to TCS
- Chamber temperature monitoring
- TCS-controlled auto-blowdown for turret source
- TCS simulator for off-line training and process development
- A second XTC/3 deposition controller to support codeposition
Electron beam source, power supply and sweep
- Upgrade to Temescal’s PopTop gun
- Up to three resistance sources
- 4-in. source well extension collar
- One additional fixed e-beam source
- One wire feeder per e-beam source on dual-source systems
- Dual wire feeders on single-source systems
- Power supply upgrade to 15-kW Temescal Simba2
- A second SS64 programmable beam sweep controller
Vacuum pumping and control
- Soft roughing and venting under TCS control
- Upgrade to a higher-capacity mechanical pump
Product chamber
- Substrate heaters
- One 5-cm ion source
- A residual gas analyzer
- A second CT-400 product chamber cryopump
- Cryopump throttling
- Product chamber hot water circulation
- Process gas control for up to three gases
- High-speed planetaries for step coverage
Process
- Additional uniformity (shadow) masks
- Process development and film characterization
- Flip tooling for two-sided coating
FC-3800 vs FC-4400 Pumpdown Comparison
Temescal FC-4400 Deposition System
For more information or to start a quote on a complete system
| Product | Capacity | Catalog # | Add product |
|---|---|---|---|
| Temescal FC-3800 deposition system | FC-3800 |
FC-3800 O-Ring & Shield Kits
| Product | Capacity | Catalog # | Add product |
|---|---|---|---|
| O-ring kit Select this to request O-ring kit information. |
0629-2355-0 | ||
| Shield kit Select this product to request Shield Kit information. |
0627-3605-3 |
I Want to Learn More
To find out more about the UEFC-5700, start by submitting your completed registration form to Temescal.