Temescal FC-4400 Deposition System

Maximum Throughtput in Lift-Off Processes

The Temescal FC-4400 represents our ultimate high-throughput platform for lift-off oriented evaporation. This system is designed to support the metallization of thirty 150mm wafers per load via high capacity e-beam evaporation.

The load locked, 44 inch x 44 inch x 28 inch product chamber can be pumped by as many as two dedicated, high throughput 16-inch cryogenic pumps. The dual-cryopump option makes it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10-inch cryopump.

Key Features:

  • Product chamber dimensions: 23.5" high x 44" x 44"
  • 25.5" diameter source tray
  • Standard source-to-substrate distance: 38"
  • S-S distance with optional source well extension collar: 42"
  • Product and source chamber cryopumps
  • Optional second product-chamber cryopump